CHA2098b
20-40GHz High Gain Buffer Amplifier
Chip Assembly and Mechanical Data
100pF
To Vdd DC Drain supply feed
IN
OUT
100pF
100pF
To Vgs1 DC Gate supply feed
To Vgs2,3 DC Gate supply feed
Note : Supply feed should be capacitively bypassed.
880
550
1670 +/- 10
970 +/- 10
520
520
240
420
720
Bonding pad positions.
( Chip thickness : 100µm. All dimensions are in micrometers )
Ref. : DSCHA20981233 21-August-01
6/8
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09