34717 查看數據表（PDF） - Freescale Semiconductor

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34717

5.0 A 1.0 MHz Fully Integrated Dual Switch-Mode Power Supply

Freescale Semiconductor 

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 2. Maximum Ratings

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Ratings

Symbol

Value

Unit

ELECTRICAL RATINGS

Input Supply Voltage (VIN) Pin

VIN

-0.3 to 7.0

V

High Side MOSFET Drain Voltage (PVIN1, PVIN2) Pins

PVIN

-0.3 to 7.0

V

Switching Node (SW1, SW2) Pins

VSW

-0.3 to 7.0

V

BOOT1, BOOT2 Pins (Referenced to SW1, SW2 Pins Respectively)

VBOOT - VSW

-0.3 to 7.0

V

PG, VOUT1, VOUT2, and SD Pins

-

-0.3 to 7.0

V

VDDI, FREQ, ILIM1, ILIM2, INV1, INV2, COMP1, COMP2, and VREFIN Pins

-

-0.3 to 3.0

V

Channel 1 Continuous Output Current(1)

Channel 2 Continuous Output Current(1)

ESD Voltage(2)

Human Body Model

Machine Model (MM)

Charge Device Model

IOUT1

+5.0

A

IOUT2

+5.0

A

V

VESD1

VESD2

VESD3

±2000

±200

±750

THERMAL RATINGS

Operating Ambient Temperature(3)

TA

-40 to 85

°C

Storage Temperature

Peak Package Reflow Temperature During Reflow(4),(5)

TSTG

-65 to +150

°C

TPPRT

Note 5

°C

Maximum Junction Temperature

Power Dissipation (TA = 85°C)(6)

TJ(MAX)

+150

°C

PD

2.03

W

Notes

1. Continuous output current capability so long as TJ is ≤ TJ(MAX).

2. ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 Ω), the Machine Model (MM)

(CZAP = 200 pF, RZAP = 0 Ω), and the Charge Device Model (CDM), Robotic (CZAP = 4.0 pF).

3. The limiting factor is junction temperature, taking into account power dissipation, thermal resistance, and heatsinking.

4. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

5. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes

and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.

6. Maximum power dissipation at indicated ambient temperature.

Analog Integrated Circuit Device Data

Freescale Semiconductor

34717

5

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