73M2901CE-IGVR 查看數據表（PDF） - Teridian Semiconductor Corporation

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73M2901CE-IGVR

V.22bis Single Chip Modem

Teridian Semiconductor Corporation 

73M2901CE Data Sheet

DS_2901CE_031

Table of Contents

1 Hardware Description.................................................................................................................... 4

1.1 Power Supply ....................................................................................................................... 4

1.2 Low Power Mode .................................................................................................................. 4

1.3 Analog Line / Hybrid Interface ............................................................................................... 4

1.4 Interrupt Pins ........................................................................................................................ 4

1.5 Crystal Oscillator................................................................................................................... 5

1.5.1 Specifying a Crystal ..................................................................................................... 5

1.6 Reset.................................................................................................................................... 5

1.7 Asynchronous and Synchronous Serial Data Interface .......................................................... 5

2 Pinout ............................................................................................................................................. 6

3 Pin Descriptions ............................................................................................................................ 7

3.1 Power Pins ........................................................................................................................... 7

3.2 Analog Interface Pins............................................................................................................ 7

3.3 Digital Interface Pins ............................................................................................................. 7

3.4 External Interrupt Pins .......................................................................................................... 8

3.5 Oscillator Pins....................................................................................................................... 8

4 Electrical Specifications................................................................................................................ 9

4.1 Absolute Maximum Ratings................................................................................................... 9

4.2 Recommended Operating Conditions.................................................................................... 9

4.3 Receiver ............................................................................................................................... 9

4.4 Transmitter ......................................................................................................................... 10

4.5 Maximum Transmit Level .................................................................................................... 10

4.6 DC Characteristics, Vcc = 3.3 V .......................................................................................... 11

4.6.1 DC Supply Current, VDD = 2.7 V (Battery EOL)......................................................... 11

4.6.2 DC Supply Current , VDD = 3.0 V .............................................................................. 11

4.6.3 DC Supply Current VDD = 3.3 V................................................................................ 12

4.6.4 DC Supply Current VDD = 3.6 V................................................................................ 12

5 Firmware Description .................................................................................................................. 13

5.1 Firmware Overview ............................................................................................................. 13

5.2 Firmware Features.............................................................................................................. 13

6 Design Considerations................................................................................................................ 14

6.1 Layout Considerations ........................................................................................................ 14

6.2 73M2901CE Design Compatibility....................................................................................... 15

6.3 Telephone Line Interface .................................................................................................... 15

6.4 Functional Considerations................................................................................................... 16

6.4.1 SMS and V.23 Half Duplex ........................................................................................ 16

6.4.2 Leased Line Mode..................................................................................................... 16

6.4.3 73M2901CE Energy Ring Detection .......................................................................... 17

6.4.4 Caller ID Mode Changes ........................................................................................... 18

6.4.5 Selectable Answer Tone Frequency Detection........................................................... 18

6.4.6 73M2901CE S99 Country Code Support ................................................................... 18

7 Reference Designs ...................................................................................................................... 21

7.1 Low Cost Design Using DSP Ring and Status Monitoring.................................................... 21

7.2 Reference Design Using Traditional Hardware Line Monitoring ........................................... 22

8 Modem Performance Characteristics ......................................................................................... 23

8.1 BER versus SNR ................................................................................................................ 23

8.2 BER versus Receive Level.................................................................................................. 23

9 Package Mechanical Drawing ..................................................................................................... 24

9.1 32-Pin QFN ........................................................................................................................ 24

9.2 32-Pin TQFP....................................................................................................................... 25

10 Ordering Information................................................................................................................... 26

11 Related Documentation............................................................................................................... 26

12 Contact Information..................................................................................................................... 26

Revision History .................................................................................................................................. 27

2

Rev. 3.4

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