74AC273(2008) 查看數據表（PDF） - Fairchild Semiconductor

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产品描述 (功能)

生产厂家

74AC273
(Rev.:2008)

Octal D-Type Flip-Flop

Fairchild Semiconductor 

Physical Dimensions (Continued)

Figure 3. 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or

obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,

specifically the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/

©1988 Fairchild Semiconductor Corporation

74AC273, 74ACT273 Rev. 1.6.0

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www.fairchildsemi.com

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