74HCT240PW 查看數據表（PDF） - NXP Semiconductors.
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74HCT240PW Datasheet PDF : 18 Pages
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NXP Semiconductors
12. Package outline
DIP20: plastic dual in-line package; 20 leads (300 mil)
74HC240; 74HCT240
Octal buffer/line driver; 3-state; inverting
SOT146-1
D
L
Z
20
e
b
pin 1 index
1
A2 A
A1
wM
b1
11
ME
c
(e 1)
MH
E
10
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.30
0.53
0.38
0.36 26.92 6.40
0.23 26.54 6.22
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
2
inches 0.17
0.02
0.13
0.068 0.021 0.014 1.060
0.051 0.015 0.009 1.045
0.25
0.24
0.1
0.3
0.14
0.12
0.32
0.31
0.39
0.33
0.01 0.078
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
OUTLINE
VERSION
IEC
SOT146-1
REFERENCES
JEDEC
JEITA
MS-001
SC-603
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-13
Fig 9. Package outline SOT146-1 (DIP20)
74HC_HCT240_3
Product data sheet
Rev. 03 — 2 August 2007
© NXP B.V. 2007. All rights reserved.
11 of 18
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