5962-9552002MXC 查看數據表（PDF） - Actel Corporation

零件编号

产品描述 (功能)

生产厂家

5962-9552002MXC

HiRel FPGAs

Actel Corporation 

HiRel FPGAs

Actel Extended Flow1

Step Screen

Method

Require-

ment

1.

Wafer Lot Acceptance2

2.

Destructive In-Line Bond Pull3

5007 with Step Coverage Waiver

2011, Condition D

All Lots

Sample

3. Internal Visual

2010, Condition A

100%

4. Serialization

100%

5. Temperature Cycling

1010, Condition C

100%

6. Constant Acceleration

7. Particle Impact Noise Detection

2001, Condition D or E, Y1 Orientation Only

2020, Condition A

100%

100%

8. Radiographic

2012 (one view only)

100%

9. Pre-Burn-In Test

In accordance with applicable Actel device specification

100%

10. Burn-in Test

1015, Condition D, 240 hours @ 125°C minimum

100%

11. Interim (Post-Burn-In) Electrical Parameters In accordance with applicable Actel device specification

100%

12. Reverse Bias Burn-In

1015, Condition C, 72 hours @ 150°C minimum

100%

13. Interim (Post-Burn-In) Electrical Parameters In accordance with applicable Actel device specification

100%

14.

Percent Defective Allowable (PDA)

Calculation

5%, 3% Functional Parameters @ 25°C

All Lots

15. Final Electrical Test

a. Static Tests

(1) 25°C

(Subgroup 1, Table1)

(2) –55°C and +125°C

(Subgroups 2, 3, Table 1)

b. Functional Tests

(1) 25°C

(Subgroup 7, Table 15)

(2) –55°C and +125°C

(Subgroups 8A and B, Table 1)

c. Switching Tests at 25°C

(Subgroup 9, Table 1)

In accordance with Actel applicable device specification

which includes a, b, and c:

5005

5005

5005

5005

5005

100%

100%

100%

100%

16. Seal

a. Fine

b. Gross

1014

100%

17. External Visual

2009

100%

Notes:

1. Actel offers the extended flow for customers who require additional screening beyond the requirements of the MIL-STD-833, Class B. Actel is

compliant to the requirements of MIL-STD-883, Paragraph 1.2.1, and MIL-I-38535, Appendix A. Actel is offering this extended flow

incorporating the majority of the screening procedures as outlined in Method 5004 of MIL-STD-883, Class S. The exceptions to Method 5004

are shown in notes 2 and 3 below.

2. Wafer lot acceptance is performed to Method 5007; however, the step coverage requirement as specified in Method 2018 must be waived.

3. MIL-STD-883, Method 5004 requires 100 percent Radiation latch-up testing (Method 1020). Actel will not be performing any radiation testing,

and this requirement must be waived in its entirety.

9

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