A700D127M006ATE018 查看數據表（PDF） - KEMET
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A700D127M006ATE018 Datasheet PDF : 12 Pages
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ALUMINUM ORGANIC CAPACITORS
Performance Characteristics
23. Resistance to Soldering Heat
• Maximum Reflow
+245 ±5°C, 10 seconds
• Typical Reflow
+230 ±5°C, 30 seconds
Post Test Performance:
a. Capacitance: within ±10% of initial value
b. DF: within initial limit
c. DC Leakage: within initial limit
d. ESR: within initial limit
24. Solderability
• Mil-Std-202, Method 208
• ANSI/J-Std-002, Test B
25. Vibration
• Mil-Std-202, Method 204, Condition D, 10 Hz to
2,000 Hz, 20G Peak
Post Test Performance:
a. Capacitance: within ±10% of initial value
b. DF: within initial limit
c. DC Leakage: within initial limit
d. ESR: within initial limit
26. Shock
• Mil-Std-202, Method 213, Condition I, 100 G
Peak
Post Test Performance:
a. Capacitance: within ±10% of initial value
b. DF: within initial limit
c. DC Leakage: within initial limit
d. ESR: within initial limit
27. Terminal Strength
• Pull Force
• One Pound (454 grams), 30 Seconds
• Tensile Force
• Four Pounds (1.8 kilograms), 60 Seconds
• Shear Force
Table 5 Maximum Shear Loads
Case Code
KEMET EIA
V 7343-20
D 7343-31
X 7343-43
Maximum Shear Loads
Kilograms Pounds
5.0
11.0
5.0
11.0
5.0
11.0
Post Test Performance:
a. Capacitance: within ±5% of initial value
b. DF: within initial limit
c. DC Leakage: within initial limit
d. ESR within initial limit
28. Handling
Automatic handling of encapsulated components is
enhanced by the molded case which provides com-
patibility with all types of high speed pick and place
equipment. Manual handling of these devices pres-
ents no unique problems. Care should be taken with
your fingers, however, to avoid touching the solder-
coated terminations as body oils, acids and salts will
degrade the solderability of these terminations.
Finger cots should be used whenever manually han-
dling all solderable surfaces.
29. Termination Coating
The standard finish coating is 100% Sn solder
(Tin-solder coated) with nickel (Ni) underplating.
30. Recommended Mounting Pad Geometries
Proper mounting pad geometries are essential for
successful solder connections. These dimensions
are highly process sensitive and should be designed
to maximize the integrity of the solder joint, and to
minimize component rework due to unacceptable
solder joints.
Figure 5 illustrates pad geometry. The table provides
recommended pad dimensions for reflow soldering
techniques. These dimensions are intended to be a
starting point for circuit board designers, to be fine
tuned, if necessary, based upon the peculiarities of
the soldering process and/or circuit board design.
Contact KEMET for Engineering Bulletin Number
F-2100 entitled "Surface Mount Mounting Pad
Dimensions and Considerations" for further details
on this subject or visit our website at
www.kemet.com.
C
Figure 5
X
Grid
Placement
Courtyard
GY
Z
62
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
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