ACPL-072L-500E 查看數據表（PDF） - Avago Technologies
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ACPL-072L-500E Datasheet PDF : 11 Pages
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Solder Reflow Temperature Profile
300
PREHEATING RATE 3˚C + 1 ˚C/- 0.5 ˚C/SEC.
REFLOW HEATING RATE 2.5˚C ± 0.5 ˚C/SEC.
PEAK
TEMP.
245 ˚C
200
160 ˚C
150 ˚C
140 ˚C
100
2.5˚ C ± 0.5˚C/SEC.
3˚C + 1 ˚C/- 0.5 ˚C
PREHEATING TIME
150 ˚C, 90 + 30 SEC.
30
SEC.
30
SEC.
PEAK
TEMP.
240 ˚C
SOLDERING
TIME
200˚C
PEAK
TEMP.
230˚C
50 SEC.
ROOM
TEMPERATURE
0
0
TIGHT
TYPICAL
LOOSE
50
100
150
200
250
TIME (SECONDS)
Note: Non-halide flux should be used
Recommended Pb-Free IR Profile
tp
Tp
TL
T smax
T smin
260 +0/-5 ˚C
217 ˚C
RAMP-UP
3 ˚C/SEC. MAX.
150 - 200 ˚C
ts
PREHEAT
tL
60 to 180 SEC.
TIME WITHIN 5 ˚C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
RAMP-DOWN
6 ˚C/SEC. MAX.
60 to 150 SEC.
25
t 25 ˚C to PEAK
TIME
NO TES:
THE TIME FROM 25 ˚C to PEAK TEMPERATURE = 8 MINUTES MAX.
T smax = 200 ˚C, Tsmin = 150 ˚C
Note: Non-halide flux should be used
Regulatory Information
Both ACPL-072L and ACPL-772L are approved by the following organizations:
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01.
(option 060 only)
UL
Approved under UL 1577, component recognition
program up, File E55361.
CSA
Approved under CSA Component Acceptance Notice #5,
File CA 88324.
5
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