Solder Reflow Thermal Profile
300
PREHEATING RATE 3 °C + 1 °C/ - 0.5 ° C/SEC.
REFLOW HEATING RATE 2.5 °C ± 0.5 ° C/SEC.
PEAK
TEMP.
245 °C
200
160 °C
150 °C
140 °C
100
2.5 °C ± 0.5 °C/SEC.
3 °C + 1 °C/ - 0.5 °C
PREHEATING TIME
150 °C, 90 + 30 SEC.
30
SEC.
30
SEC.
PEAK
TEMP.
240 °C
SOLDERING
TIME
200 °C
PEAK
TEMP.
230 °C
50 SEC.
ROOM
TEMPERATURE
00
TIGHT
TYPICAL
LOOSE
50
100
150
200
250
TIME (SECONDS)
Note: Non-halide flux should be used.
Recommended Pb-Free IR Profile
tp
Tp
TL
T smax
T smin
260 +0/-5°C
217 °C
RAMP-UP
3 °C/SEC. MAX.
150 - 200°C
ts
PREHEAT
tL
60 to 180 SEC.
TIME WITHIN 5°C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
RAMP-DOWN
6 °C/SEC. MAX.
60 to 150 SEC.
25
t 25 °C to PEAK
TIME
NO TES:
THE TIME FROM 25°C to PEAK TEMPERATURE = 8 MINUTES MAX.
Tsmax = 200°C, Tsmin = 150 °C
Note: Non-halide flux should be used.