ACPL-827-50CE 查看數據表（PDF） - Avago Technologies
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ACPL-827-50CE Datasheet PDF : 9 Pages
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ACPL-847 Package Outline - Option W00
LEAD FREE
PIN ONE DOT
A 847
YYWW
DATE CODE
6.50 ±0.50
0.256 ±0.020
19.84 ±0.50
0.781 ±0.020
2.80 ±0.50
0.11 ±0.02
2.54 ±0.25
0.10 ±0.01
DIMENSIONS IN [MILLIMETERS] AND INCHES
ACPL-847 Package Outline - Option 300
LEAD FREE
RANK
3.50 ±0.50
0.138 ±0.020
0.50 ±0.10
0.02 ±0.00
DATE CODE
PIN ONE DOT
A 847
YYWW
6.50 ±0.50
0.256 ±0.020
7.62 ±0.30
0.30 ±0.01
10.16 ±0.50
0.40 ±0.02
6.90 ±0.50
0.272 ±0.020
19.84 ±0.50
0.781 ±0.020
RANK
3.50 ±0.50
0.138 ±0.020
7.62 ±0.30
0.30 ±0.01
1.20 ±0.10
0.05 ±0.00
2.54 ±0.25
0.10 ±0.01
DIMENSIONS IN [MILLIMETERS] AND INCHES
0.35 ±0.25
1 ±0.25
0.26
0.01 ±0.01
0.039 ±0.010
0.01
10.16 ±0.30
0.40 ±0.01
Solder Reflow Temperature Profile
1. One-time soldering reflow is recommended within
the condition of temperature and time profile shown
at right.
2. When using another soldering method such as
infrared ray lamp, the temperature may rise partially
in the mold of the device. Keep the temperature on
150°C
the package of the device within the condition of (1)
above.
Note: Non-halide flux should be used.
25°C
6
250°C
217°C
200°C
30 seconds
260 °C (Peak Temperature)
60 sec
60 ~ 150 sec
90 sec
Time (sec)
60 sec
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