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ACPL-K43T-500E 查看數據表(PDF) - Avago Technologies

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ACPL-K43T-500E Datasheet PDF : 11 Pages
First Prev 11
R31 : Thermal Resistance of Die3 due to heating of Die1 (˚C/W)
R32 : Thermal Resistance of Die3 due to heating of Die2 (˚C/W)
R33 : Thermal Resistance of Die3 due to heating of Die3 (˚C/W)
R34 : Thermal Resistance of Die3 due to heating of Die4 (˚C/W)
R41 : Thermal Resistance of Die4 due to heating of Die1 (˚C/W)
R42 : Thermal Resistance of Die4 due to heating of Die2 (˚C/W)
R43 : Thermal Resistance of Die4 due to heating of Die3 (˚C/W)
R44 : Thermal Resistance of Die4 due to heating of Die4 (˚C/W)
P1 : Power dissipation of Die1 (W)
P2 : Power dissipation of Die2.
P3 : Power dissipation of Die3 (W)
P4 : Power dissipation of Die4.
T1 : Junction temperature of Die1 due to heat from all dice (˚C)
T2 : Junction temperature of Die2 due to heat from all dice (˚C)
T3 : Junction temperature of Die3 due to heat from all dice (˚C)
T4 : Junction temperature of Die4 due to heat from all dice (˚C)
Ta : Ambient temperature (˚C)
T1 : Temperature difference between Die1 junction and ambient (˚C)
T2 : Temperature deference between Die2 junction and ambient (˚C)
T3 : Temperature difference between Die3 junction and ambient (˚C)
T4 : Temperature deference between Die4 junction and ambient (˚C)
T1 = (R11 x P1 + R12 x P2 + R13 x P3 + R14 x P4 ) + Ta -- (1)
T2 = (R21 x P1 + R22 x P2 + R23 x P3 + R24 x P4) + Ta -- (2)
T3 = (R31 x P1 + R32 x P2 + R33 x P3 + R34 x P4) + Ta -- (3)
T4 = (R41 x P1 + R42 x P2 + R43 x P3 + R44 x P4 ) + Ta -- (4)
Measurement data on a low K board:
R11 R12 R13 R14 R21 R22 R23 R24 R31 R32 R33 R34 R41 R42 R43 R44
160 76 76 76 76 115 76 76 76 76 160 76 76 76 76 115
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Data subject to change. Copyright © 2005-2012 Avago Technologies. All rights reserved.
AV02-3179EN - June 20, 2012

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