ACPM-7371 查看數據表（PDF） - Avago Technologies
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ACPM-7371 Datasheet PDF : 15 Pages
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PCB Design Guidelines
The recommended ACPM-7371 PCB land pattern is
0.7
shown in Figure 12 and Figure13. The substrate is coated
with solder mask between the I/O and conductive paddle 0.5
to protect the gold pads from short circuit that is caused
by solder bleeding/bridging.
Stencil Design Guidelines
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads. The recommended stencil layout is
shown in Figure14. Reducing the stencil opening can po-
tentially generate more voids. On the other hand, stencil
openings larger than 100% will lead to excessive solder
paste smear or bridging across the I/O pads or conduc-
tive paddle to adjacent I/O pads. Considering the fact
that solder paste thickness will directly affect the quality
of the solder joint, a good choice is to use laser cut stencil
composed of 0.10mm (4mils) or 0.127mm (5mils) thick
stainless steel which is capable of producing the required
fine stencil outline.
0.1
0.6
0.85
2.4
Figure 13. Solder Mask Opening
0.6
0.4
0.4
0.55
1.8
0.5
1.6
0.85
0.25
Figure 12. Metallization
0.5
Ø 0.3mm
on 0.6mm pitch
0.85
2.0
Figure 14. Solder Paste Stencil Aperture
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