ACPM-7392 查看數據表（PDF） - Avago Technologies
零件编号
产品描述 (功能)
生产厂家
ACPM-7392 Datasheet PDF : 18 Pages
| |||
Metallization
0.1
0.6
0.5
0.4
0.85
0.25
Solder Mask Opening
0.7
0.5
Ø 0.3mm
on 0.6mm pitch
0.55
1.8
PCB Design Guidelines
The recommended PCB land pattern is shown in fig-
ures on the left side. The substrate is coated with solder
mask between the I/O and conductive paddle to protect
the gold pads from short circuit that is caused by solder
bleeding/bridging.
Stencil Design Guidelines
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads.
The recommended stencil layout is shown here. Reducing
the stencil opening can potentially generate more voids.
On the other hand, stencil openings larger than 100% will
lead to excessive solder paste smear or bridging across
the I/O pads or conductive paddle to adjacent I/O pads.
Considering the fact that solder paste thickness will di-
rectly affect the quality of the solder joint, a good choice
is to use laser cut stencil composed of 0.100mm(4mils) or
0.127mm(5mils) thick stainless steel which is capable of
producing the required fine stencil outline.
0.85
2.4
Solder Paste Stencil Aperture
0.6
0.4
0.5
1.6
0.85
2.0
10
Share Link: 