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ACT4070 查看數據表(PDF) - Unspecified

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ACT4070 Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
ORDERING INFORMATION
PART NUMBER
ACT4070YH
ACT4070YH-T
TEMPERATURE RANGE
-40°C to 85°C
-40°C to 85°C
PIN CONFIGURATION
ACT4070
PACKAGE
SOP-8/EP
SOP-8/EP
PINS
8
8
PACKING
TUBE
TAPE & REEL
PIN DESCRIPTION
SOP-8/EP
PIN NUMBER PIN NAME
PIN DESCRIPTION
1
BS
Bootstrap. This pin acts as the positive rail for the high-side switch’s gate driver.
Connect a 10nF between this pin and SW.
2
IN
Input Supply. Bypass this pin to G with a low ESR capacitor. See Input Capacitor
in Application Information section.
3
SW
Switch Output. Connect this pin to the switching end of the inductor.
4
G
Ground.
5
FB
Feedback Input. The voltage at this pin is regulated to 1.222V. Connect to the
resistor divider between output and ground to set output voltage.
6
COMP
Compensation Pin. See Compensation Technique in Application Information sec-
tion.
Enable Input. When higher than 1.3V, this pin turns the IC on. When lower than
7
EN
0.7V, this pin turns the IC off. Output voltage is discharged when the IC is off. This
pin has a small internal pull up current to a high level voltage when pin is not con-
nected.
8
N/C
Not Connected.
Exposed Pad shown as dashed box. The exposed thermal pad should be con-
nected to board ground plane and pin 4. The ground plane should include a large
EP
EP
exposed copper pad under the package for thermal dissipation (see package out-
line). The leads and exposed pad should be flush with the board, without offset
from the board surface.
Innovative Products. Active Solutions.
-2-
Copyright © 2006 Active-Semi, Inc.
www.active-semi.com

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