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AD7818ARZ-REEL7 查看數據表(PDF) - Analog Devices

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AD7818ARZ-REEL7 Datasheet PDF : 20 Pages
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Data Sheet
ABSOLUTE MAXIMUM RATINGS
TA = 25°C unless otherwise noted.
Table 3.
Parameter
VDD to AGND
VDD to DGND
Analog Input Voltage to AGND
VIN1 to VIN4
Reference Input Voltage to AGND1
Digital Input Voltage to DGND
Digital Output Voltage to DGND
Storage Temperature Range
Junction Temperature
16-Lead TSSOP, Power Dissipation
θJA Thermal Impedance
Lead Temperature, Soldering
Vapor Phase (60 sec)
Infrared (15 sec)
16-Lead SOIC Package, Power Dissipation
θJA Thermal Impedance
Lead Temperature, Soldering
Vapor Phase (60 sec)
Infrared (15 sec)
8-Lead SOIC Package, Power Dissipation
θJA Thermal Impedance
Lead Temperature, Soldering
Vapor Phase (60 sec)
Infrared (15 sec)
8-Lead MSOP Package, Power Dissipation
θJA Thermal Impedance
Lead Temperature, Soldering
Vapor Phase (60 sec)
Infrared (15 sec)
Rating
−0.3 V to +7 V
−0.3 V to +7 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3V
–0.3 V to VDD + 0.3 V
–0.3 V to VDD + 0.3 V
−65°C to +150°C
150°C
450 mW
120°C/W
260°C
215°C
220°C
450 mW
100°C/W
215°C
220°C
450 mW
157°C/W
215°C
220°C
450 mW
206°C/W
215°C
220°C
1 If the reference input voltage is likely to exceed VDD by more than 0.3 V (that
is, during power-up) and the reference is capable of supplying 30 mA or more, it
is recommended to use a clamping diode between the REFIN pin and VDD pin.
Connect the diode as shown in this figure.
AD7817/AD7818
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Rev. D | Page 7 of 20

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