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AD8222-EVAL 查看數據表(PDF) - Analog Devices

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AD8222-EVAL Datasheet PDF : 24 Pages
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AD8222
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Supply Voltage
Output Short-Circuit Current
Input Voltage (Common Mode)
Differential Input Voltage
Storage Temperature Range
Operational Temperature Range
Package Glass Transition Temperature (TG)
ESD (Human Body Model)
ESD (Charge Device Model)
Rating
±18 V
Indefinite
±VS
±VS
−65°C to +130°C
−40°C to +125°C
130°C
1 kV
1 kV
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions may affect device reliability.
THERMAL RESISTANCE
Table 6.
Thermal Pad
Soldered to Board
Not Soldered to Board
θJA
Unit
48
°C/W
86
°C/W
The θJA values in Table 6 assume a 4-layer JEDEC standard
board. If the thermal pad is soldered to the board, then it is
also assumed it is connected to a plane. θJC at the exposed pad
is 4.4°C/W.
Maximum Power Dissipation
The maximum safe power dissipation for the AD8222 is limited
by the associated rise in junction temperature (TJ) on the die. At
approximately 130°C, which is the glass transition temperature,
the plastic changes its properties. Even temporarily exceeding
this temperature limit may change the stresses that the package
exerts on the die, permanently shifting the parametric performance
of the amplifiers. Exceeding a temperature of 130°C for an
extended period can result in a loss of functionality.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. 0 | Page 6 of 24

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