5962-89640012A 查看數據表（PDF） - Analog Devices

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5962-89640012A

Wideband, Fast Settling Op Amp

Analog Devices 

AD840

NOTES

1Input offset voltage specifications are guaranteed after 5 minutes at TA = +25°C.

2Full power bandwidth = slew rate/2 π VPEAK.

3Refer to Figures 22 and 23.

4“S” grade TMIN–TMAX specifications are tested with automatic test equipment at TA = –55°C and TA = +125°C.

All min and max specifications are guaranteed. Specifications shown in boldface are tested on all production units.

Specifications subject to change without notice.

ABSOLUTE MAXIMUM RATINGS1

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 18 V

Internal Power Dissipation2

Plastic (N) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 W

Cerdip (Q) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 W

LCC (E) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0 W

Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± VS

Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . ± 6 V

Storage Temperature Range

Q, E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–65°C to +150°C

N . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–65°C to +125°C

Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . +175°C

Lead Temperature Range (Soldering 60 sec) . . . . . . . . +300°C

NOTES

1Stresses above those listed under “Absolute Maximum Ratings” may cause

permanent damage to the device. This is a stress rating only, and functional

operation of the device at these or any other conditions above those indicated in

the operational section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

2Maximum internal power dissipation is specified so that TJ does not exceed

+175°C at an ambient temperature of +25°C.

Thermal Characteristics:

Cerdip Package

θJC

30°C/W

θJA

110°C/W

Derate at

8.7 mW/°C

Plastic Package

30°C/W

100°C/T

10 mW/°C

LCC Package

35°C/W

150°C/W

6.7 mW/°C

Recommended Heat Sink:

Aavid Engineering© #602B

ORDERING GUIDE

Models

Package Options2

AD840JN

AD840KN

AD840JQ

AD840KQ

AD840SQ

AD840SQ-883B

5962-89640012A

AD840SE-883B

5962-8964001CA

N-14

N-14

Q-14

Q-14

Q-14

Q-14

Q-14

E-20A

E-20A

NOTES

1J and S Grade Chips also available.

2N = Plastic DIP; Q = Cerdip; E = LCC (Leadless

2Ceramic Chip Carrier).

Plastic DIP (N) Package

and

Cerdip (Q) Package

LCC (E) Package

AD840 Connection Diagrams

METALIZATION PHOTOGRAPH

Contact factory for latest dimensions.

Dimensions shown in inches and (mm).

REV. C

–3–

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