AD8566 查看數據表（PDF） - Analog Devices

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AD8566

16 V Rail-to-Rail Operational Amplifiers

Analog Devices 

AD8565/AD8566/AD8567

This input current is not inherently damaging to the device as

long as it is limited to 5 mA or less. If a condition exists using

the AD856x where the input exceeds the supply more than

0.6 V, an external series resistor should be added. The size of the

resistor can be calculated by using the maximum overvoltage

divided by 5 mA. This resistance should be placed in series with

either input exposed to an overvoltage.

OUTPUT PHASE REVERSAL

The AD856x family is immune to phase reversal. Although the

device’s output does not change phase, large currents due to

input overvoltage could damage the device. In applications

where the possibility of an input voltage exceeding the supply

voltage exists, overvoltage protection should be used as

described in the Input Overvoltage Protection section.

POWER DISSIPATION

The maximum allowable internal junction temperature of

150°C limits the AD856x family’s maximum power dissipation

of AD856x devices. As the ambient temperature increases, the

maximum power dissipated by AD856x devices must decrease

linearly to maintain the maximum junction temperature. If this

maximum junction temperature is exceeded momentarily, the

device still operates properly once the junction temperature is

reduced below 150°C. If the maximum junction temperature is

exceeded for an extended period, overheating could lead to

permanent damage of the device.

The maximum safe junction temperature, TJMAX, is 150°C. Using

the following formula, the maximum power that an AD856x

device can safely dissipate as a function of temperature can be

obtained:

PDISS = TJMAX − TA/θJA

where:

PDISS is the AD856x power dissipation.

TJMAX is the AD856x maximum allowable junction temperature

(150°C).

TA is the ambient temperature of the circuit.

θJA is the AD856x package thermal resistance, junction-to-ambient.

The power dissipated by the device can be calculated as

PDISS = (VS − VOUT) × ILOAD

where:

VS is the supply voltage.

VOUT is the output voltage.

ILOAD is the output load current.

Figure 30 shows the maximum power dissipation vs.

temperature. To achieve proper operation, use the previous

equation to calculate PDISS for a specific package at any given

temperature or use Figure 30.

1.25

14-LEAD SOIC

1.00

0.75

14-LEAD TSSOP

8-LEAD MSOP

0.50

5-LEAD SOT-23

0.25

0

–35

–15

5

25

45

65

85

AMBIENT TEMPERATURE (°C)

Figure 30. Maximum Power Dissipation vs. Temperature

for 5-Lead SC70, 8-Lead MSOP, and 14-Lead TSSOP/SOIC Packages

THERMAL PAD—AD8567

The AD8567 LFCSP comes with a thermal pad that is attached

to the substrate. This substrate is connected to VDD. To be

electrically safe, the thermal pad should be soldered to an area

on the board that is electrically isolated or connected to VDD.

Attaching the thermal pad to ground adversely affects the

performance of the part.

Soldering down this thermal pad dramatically improves the

heat dissipation of the package. It is necessary to attach vias that

connect the soldered thermal pad to another layer on the board.

This provides an avenue to dissipate the heat away from the

part. Without vias, the heat is isolated directly under the part.

Rev. D | Page 10 of 16

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