AD9434(RevA) 查看數據表（PDF） - Analog Devices
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AD9434 Datasheet PDF : 28 Pages
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AD9434
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Electrical
AVDD to AGND
DRVDD to DRGND
AGND to DRGND
AVDD to DRVDD
D0+/D0− Through D11+/D11−
to DRGND
DCO+, DCO− to DRGND
OR+, OR− to DRGND
CLK+ to AGND
CLK− to AGND
VIN+ to AGND
VIN− to AGND
CML to AGND
VREF to AGND
SDIO to DRGND
PDWN to AGND
CSB to AGND
SCLK/DFS to AGND
Environmental
Storage Temperature Range
Operating Temperature Range
Lead Temperature
(Soldering, 10 sec)
Junction Temperature
Rating
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +0.3 V
−2.0 V to +2.0 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−65°C to +125°C
−40°C to +85°C
300°C
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the PCB
increases the reliability of the solder joints, maximizing the
thermal capability of the package.
Table 6.
Package Type
θJA
θJC
56-Lead LFCSP_VQ (CP-56-5) 23.7
1.7
Unit
°C/W
Typical θJA and θJC are specified for a 4-layer board in still air.
Airflow increases heat dissipation, effectively reducing θJA. In
addition, metal in direct contact with the package leads from
metal traces, through holes, ground, and power planes reduces
the θJA.
ESD CAUTION
Rev. A | Page 8 of 28
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