AD9444 查看數據表（PDF） - Analog Devices
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AD9444 Datasheet PDF : 40 Pages
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AD9444
ABSOLUTE MAXIMUM RATINGS
Table 5.
With
Parameter
Respect to Min Max
Unit
ELECTRICAL
AVDD1
AGND
−0.3 +4
V
AVDD2
AGND
−0.3 +6
V
DRVDD
DGND
−0.3 +4
V
AGND
DGND
−0.3 +0.3
V
AVDD1
DRVDD
−4 +4
V
AVDD2
DRVDD
−4 +6
V
AVDD2
AVDD1
−4 +6
V
D0 to D13
DGND
–0.3 DRVDD + 0.3 V
CLK, MODE AGND
–0.3 AVDD1 + 0.3 V
VIN+, VIN−
AGND
–0.3 AVDD2 + 0.3 V
VREF
AGND
–0.3 AVDD1 + 0.3 V
SENSE
AGND
–0.3 AVDD1 + 0.3 V
REFT, REFB
AGND
–0.3 AVDD1 + 0.3 V
ENVIRONMENTAL
Storage Temperature
–65 +125
°C
Operating Temperature Range –40 +85
°C
Lead Temperature Range
(Soldering 10 sec)
300
°C
Junction Temperature
150
°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Thermal Resistance
The heat sink of the AD9444 package must be soldered to
ground.
Table 6.
Package Type
100-Lead TQFP/EP
θJA
θJB
θJC
Unit
19.8 8.3
2
°C/W
Typical θJA = 19.8°C/W (heat-sink soldered) for multilayer
board in still air.
Typical θJB = 8.3°C/W (heat-sink soldered) for multilayer board
in still air.
Typical θJC = 2°C/W (junction to exposed heat sink) represents
the thermal resistance through heat-sink path.
Airflow increases heat dissipation effectively reducing θJA. Also,
more metal directly in contact with the package leads, from
metal traces, through holes, ground, and power planes, reduces
the θJA. It is required that the exposed heat sink be soldered to
the ground plane.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features proprie-
tary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic
discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of
functionality.
Rev. 0 | Page 8 of 40
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