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AD9445 查看數據表(PDF) - Analog Devices

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AD9445 Datasheet PDF : 40 Pages
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AD9445
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
ELECTRICAL
AVDD1
AVDD2
DRVDD
AGND
AVDD1
AVDD2
AVDD2
D0± to D13±
CLK+/CLK−
OUTPUT MODE, DCS
MODE, DFS, SFDR,
RF ENABLE
VIN+, VIN−
VREF
SENSE
REFT, REFB
ENVIRONMENTAL
Storage Temperature
Range
Operating Temperature
Range
Lead Temperature
(Soldering 10 sec)
Junction Temperature
With
Respect
To
Rating
AGND
AGND
DGND
DGND
DRVDD
DRVDD
AVDD1
DGND
AGND
AGND
−0.3 V to +4 V
−0.3 V to +6 V
−0.3 V to +4 V
−0.3 V to +0.3 V
−4 V to +4 V
−4 V to +6 V
−4 V to +6 V
–0.3 V to DRVDD + 0.3 V
–0.3 V to AVDD1 + 0.3 V
–0.3 V to AVDD1 + 0.3 V
AGND
AGND
AGND
AGND
–0.3 V to AVDD2 + 0.3 V
–0.3 V to AVDD1 + 0.3 V
–0.3 V to AVDD1 + 0.3 V
–0.3 V to AVDD1 + 0.3 V
–65°C to +125°C
–40°C to +85°C
300°C
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The heat sink of the AD9445 package must be soldered to ground.
Table 6.
Package Type
100-lead TQFP/EP
θJA
θJB
θJC
Unit
19.8 8.3
2
°C/W
Typical θJA = 19.8°C/W (heat sink soldered) for multilayer
board in still air.
Typical θJB = 8.3°C/W (heat sink soldered) for multilayer board
in still air.
Typical θJC = 2°C/W (junction to exposed heat sink) represents
the thermal resistance through heat sink path.
Airflow increases heat dissipation, effectively reducing θJA. Also,
more metal directly in contact with the package leads from
metal traces through holes, ground, and power planes reduces
the θJA. It is required that the exposed heat sink be soldered to
the ground plane.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. 0 | Page 8 of 40

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