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AD9575(Rev0) 查看數據表(PDF) - Analog Devices

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AD9575
(Rev.:Rev0)
ADI
Analog Devices ADI
AD9575 Datasheet PDF : 16 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
ABSOLUTE MAXIMUM RATINGS
Table 9.
Parameter
VDD, VDDA, VDDX, VDD_CMOS to GND
XO1, XO2 to GND
LVDS/LVPECL OUT, LVDS/LVPECL OUT,
CMOS OUT/SEL1 to GND
Junction Temperature1
Storage Temperature Range
Lead Temperature (10 sec)
Rating
−0.3 V to +3.6 V
−0.3 V to VS + 0.3 V
−0.3 V to VS + 0.3 V
150°C
−65°C to +150°C
300°C
1 See Table 10 for θJA.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
AD9575
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 10. Thermal Resistance1
Package Type
θJA
16-Lead TSSOP
90.3
Unit
°C/W
1 Thermal impedance measurements were taken on a 4-layer board in still air
in accordance with EIA/JESD51-7.
ESD CAUTION
Rev. 0 | Page 7 of 16

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