AD-DPGIOZ 查看數據表（PDF） - Analog Devices

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AD-DPGIOZ

10-/12-Bit, Low Power, Broadband MxFE

Analog Devices 

AD9961/AD9963

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

RX33V, AUX33V

TXVDD

DRVDD

CLK33V

RX18V, RX18VF

DVDD18V

CLK18V, DLL18V

RXGND, TXGND, DGND,

TXIP, TXIN, TXQP, TXQN

RXIP, RXIN, RXQP, RXQN

CS, SCLK, SDIO, RESET,

LDO_EN

TRXD[11:0], TXD[11:0], TXIQ,

TRXIQ, TXCLK, TRXCLK

CLKP, CLKN

Junction Temperature

Storage Temperature Range

With

Respect to

RXGND

TXGND

DGND

EPAD

RXGND

EPAD

EPAD

EPAD

TXGND

RXGND

DGND

DGND

EPAD

Rating

−0.3 V to +3.9 V

−0.3 V to +3.9 V

−0.3 V to +3.9 V

−0.3 V to +3.9 V

−0.3 to +2.1 V

−0.3 to +2.1 V

−0.3 to +2.1 V

−0.3 V to +0.3 V

−1.0 V to TXVDD +

0.3 V

−0.3 V to RX18V +

0.3 V

−0.3V to DRVDD +

0.3 V

−0.3 V to DRVDD +

0.3 V

−0.3 V to CLK33V +

0.3 V

+125°C

−65°C to +150°C

Data Sheet

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

The exposed paddle must be soldered to the ground plane for

the LFCSP package. Soldering the exposed paddle to the

customer board increases the reliability of the solder joints,

maximizing the thermal capability of the package.

Table 7. Thermal Resistance

Airflow

1 m/sec

θJA

θJB θJC Unit

17.1 10.6 1.0 °C/W

0 m/sec

20.3

°C/W

Typical θJA, θJB, and θJC are specified for a JEDEC standard 51-7

High-κ thermal test board. Airflow increases heat dissipation,

effectively reducing θJA. In addition, metal in direct contact with

the package leads from metal traces, through holes, ground, and

power planes, reduces the θJA.

ESD CAUTION

Rev. A | Page 8 of 60

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