ADA4817-1ACPZ-RL 查看數據表（PDF） - Analog Devices

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ADA4817-1ACPZ-RL

Low Noise, 1 GHz FastFET Op Amps

Analog Devices 

ADA4817-1/ADA4817-2

Data Sheet

TABLE OF CONTENTS

Features .............................................................................................. 1

Applications....................................................................................... 1

Connection Diagrams ...................................................................... 1

General Description ......................................................................... 1

Revision History ............................................................................... 2

Specifications..................................................................................... 3

±5 V Operation............................................................................. 3

5 V Operation ............................................................................... 4

Absolute Maximum Ratings............................................................ 5

Thermal Resistance ...................................................................... 5

Maximum Safe Power Dissipation ............................................. 5

ESD Caution.................................................................................. 5

Pin Configurations and Function Descriptions ........................... 6

Typical Performance Characteristics ............................................. 8

Test Circuits..................................................................................... 13

Theory of Operation ...................................................................... 14

Closed-Loop Frequency Response........................................... 14

Noninverting Closed-Loop Frequency Response .................. 14

Inverting Closed-Loop Frequency Response ............................. 14

Wideband Operation ................................................................. 15

Driving Capacitive Loads.......................................................... 15

Thermal Considerations............................................................ 15

Power-Down Operation ............................................................ 15

Capacitive Feedback................................................................... 16

Higher Frequency Attenuation................................................. 16

Layout, Grounding, and Bypassing Considerations .................. 17

Signal Routing............................................................................. 17

Power Supply Bypassing ............................................................ 17

Grounding ................................................................................... 17

Exposed Paddle........................................................................... 17

Leakage Currents........................................................................ 18

Input Capacitance ...................................................................... 18

Input-to-Input/Output Coupling............................................. 18

Applications Information .............................................................. 19

Low Distortion Pinout............................................................... 19

Wideband Photodiode Preamp ................................................ 19

High Speed JFET Input Instrumentation Amplifier.............. 21

Active Low-Pass Filter (LPF) .................................................... 22

Outline Dimensions ....................................................................... 24

Ordering Guide .......................................................................... 25

REVISION HISTORY

5/13—Rev. A to Rev. B

Changes to Figure 3 .......................................................................... 1

Changes to Figure 7 .......................................................................... 7

Updated Outline Dimensions ....................................................... 24

Changes to Ordering Guide .......................................................... 25

3/09—Rev. 0 to Rev. A

Added 8-Lead SOIC Package ............................................Universal

Changes to Features Section and General Description Section . 1

Changes to Table 1............................................................................ 3

Changes to Table 2............................................................................ 4

Changes to Figure 4 .......................................................................... 5

Changes to Figure 9, Figure 11, and Figure 12 ............................. 8

Changes to Figure 21, Figure 22, and Figure 24 ......................... 10

Changes to Figure 33...................................................................... 12

Added Figure 34; Renumbered Sequentially .............................. 12

Changes to Thermal Considerations Section and Power-Down

Operation Section........................................................................... 15

Changes to Capacitive Feedback Section and Figure 46 ........... 16

Added Higher Frequency Attenuation Section, Figure 47,

Figure 48, and Figure 49; Renumbered Sequentially ................. 16

Updated Outline Dimensions ....................................................... 24

Changes to Ordering Guide .......................................................... 25

11/08—Revision 0: Initial Version

Rev. B | Page 2 of 28

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