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ADG1406BRUZ-REEL7 查看數據表(PDF) - Analog Devices

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ADG1406BRUZ-REEL7 Datasheet PDF : 20 Pages
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ADG1406/ADG1407
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 7.
Parameter
Rating
VDD to VSS
VDD to GND
VSS to GND
Analog, Digital Inputs1
Continuous Current, Sx or Dx Pins
Peak Current, Sx or Dx Pins (Pulsed
at 1 ms, 10% Duty Cycle
Maximum)
28-Lead TSSOP
35 V
−0.3 V to +25 V
+0.3 V to −25 V
VSS − 0.3 V to VDD + 0.3 V
or 30 mA, whichever
occurs first
Table 5 and Table 6
specifications + 15%
300 mA
32-Lead LFCSP_VQ
Operating Temperature Range
Industrial (B Version)
Storage Temperature Range
Junction Temperature
Reflow Soldering, Pb-Free
Peak Temperature
Time at Peak Temperature
550 mA
–40°C to +125°C
–65°C to +150°C
150°C
260 (+0/−5)°C
10 sec to 40 sec
1 Overvoltages at the Ax, EN, Sx, or Dx pins are clamped by internal diodes.
Limit current to the maximum ratings given.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating may be applied at any
one time.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 8. Thermal Resistance
Package Type
θJA
θJC
28-Lead TSSOP
97.9
14
32-Lead LFCSP_VQ
27.27
Unit
°C/W
°C/W
ESD CAUTION
Rev. 0 | Page 8 of 20

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