ADG772(RevC) 查看數據表（PDF） - Analog Devices
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ADG772
(Rev.:RevC)
(Rev.:RevC)
Analog Devices
ADG772 Datasheet PDF : 12 Pages
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Data Sheet
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
ADG772
D1 2
S1B 3
ADG772
TOP VIEW
(Not to Scale)
8 D2
7 S2B
Figure 2. 10-Lead Mini LFCSP Pin Configuration
D1 1
S1B 2
NC 3
ADG772
TOP VIEW
(Not to Scale)
9 D2
8 S2BB
7 NC
NOTES
1. NC = NO CONNECT.
2. THE EXPOSED PAD IS CONNECTED INTERNALLY.
FOR INCREASED RELIABILITY OF THE SOLDER
JOINTS AND MAXIMUM THERMAL CAPABILITY, IT
IS RECOMMENDED THAT THE PAD BE SOLDERED
TO A GROUND REFERENCE.
Figure 3. 12-Lead LFCSP Pin Configuration
Table 3. Pin Function Descriptions
Pin No.
10-Lead Mini LFCSP 12-Lead LFCSP
1
12
2
1
3
2
4
4
5
5
6
6
7
8
8
9
9
10
10
11
Not applicable
3, 7
Not applicable
13
TRUTH TABLE
Table 4.
Logic (IN1 or IN2)
0
1
Mnemonic
S1A
D1
S1B
IN1
IN2
VDD
S2B
D2
S2A
GND
NC
EPAD
Description
Source Terminal. Can be an input or an output.
Drain Terminal. Can be an input or an output.
Source Terminal. Can be an input or an output.
Logic Control Input. This pin controls Switch S1A and Switch S1B to D1.
Login Control Input. This pin controls Switch S2A and Switch S2B to D2.
Most Positive Power Supply Potential.
Source Terminal. Can be an input or an output.
Drain Terminal. Can be an input or an output.
Source Terminal. Can be an input or an output.
Ground (0 V) Reference.
No Connect.
Exposed Pad. The exposed pad is connected internally. For increased
reliability of the solder joints and maximum thermal capability, it is
recommended that the pad be soldered to a ground reference.
Switch A (S1A or S2A)
Off
On
Switch B (S1B or S2B)
On
Off
Rev. C | Page 5 of 12
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