ADM1031ARQZ 查看數據表（PDF） - ON Semiconductor

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ADM1031ARQZ

Intelligent Temperature Monitor and Dual PWM Fan Controller

ON Semiconductor 

ADM1031

PWM_OUT1 1

PWM_OUT2 3

TACH2/AIN2 4

TACH1/AIN1 2

D1+ 10

D1– 9

D2+ 12

D2– 11

VCC

6

ADM1031

PWM

CONTROLLERS

TACH SIGNAL

CONDITIONING

SLAVE

ADDRESS

REGISTER

FAN FILTER

REGISTER

FAN

CHARACTERISTICS

REGISTER

FAN SPEED

CONFIG

REGISTER

FAN SPEED

COUNTER

BANDGAP

TEMPERATURE

SENSOR

ANALOG

MULTIPLEXER

ADC

2.5V

BANDGAP

REFERENCE

5

GND

SERIAL BUS

INTERFACE

ADDRESS

POINTER

REGISTER

INTERRUPT

STATUS

REGISTERS

LIMIT

COMPARATOR

VALUE AND LIMIT

REGISTERS

OFFSET

REGISTERS

CONFIGURATION

REGISTERS

Figure 1. Functional Block Diagram

13 ADD

15 SDA

16 SCL

14 INT (SMBALERT)

7 THERM

8 FAN_FAULT

ABSOLUTE MAXIMUM RATINGS

Parameter

Rating

Unit

Positive Supply Voltage (VCC)

Voltage on Any Input or Output Pin

6.5

V

−0.3 to +6.5

V

Input Current at Any Pin

±5

mA

Package Input Current

±20

mA

Maximum Junction Temperature (TJ max)

150

°C

Storage Temperature Range

−65 to +150

°C

Lead Temperature, Soldering

Vapor Phase (60 sec)

Infrared (15 sec)

°C

215

200

ESD Rating − All Pins

2000

V

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.

THERMAL CHARACTERISTICS

Package Type

qJA

qJC

Unit

16−lead QSOP

105

39

°C/W

NOTE: qJA is specified for the worst−case conditions, that is, a device soldered in a circuit board for surface−mount packages.

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