ADP190 查看數據表（PDF） - Analog Devices

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ADP190

Logic Controlled, High-Side Power Switches

Analog Devices 

Data Sheet

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

VIN to GND Pins

VOUT to GND Pins

EN to GND Pins

Continuous Drain Current

TA = 25°C

TA = 85°C

Continuous Diode Current

Storage Temperature Range

Operating Junction Temperature Range

Soldering Conditions

Rating

−0.3 V to +4.0 V

−0.3 V to VIN

−0.3 V to +4.0 V

±1 A

±500 mA

−50 mA

−65°C to +150°C

−40°C to +125°C

JEDEC J-STD-020

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL DATA

Absolute maximum ratings apply individually only, not in

combination. The ADP190/ADP191 can be damaged when the

junction temperature limits are exceeded. Monitoring ambient

temperature does not guarantee that TJ is within the specified

temperature limits. In applications with high power dissipation

and poor PCB thermal resistance, the maximum ambient

temperature may need to be derated.

In applications with moderate power dissipation and low PCB

thermal resistance, the maximum ambient temperature can

exceed the maximum limit as long as the junction temperature

is within specification limits. The junction temperature (TJ) of

the device is dependent on the ambient temperature (TA), the

power dissipation of the device (PD), and the junction-to-ambient

thermal resistance of the package (θJA).

Maximum junction temperature (TJ) is calculated from the

ambient temperature (TA) and power dissipation (PD) using the

formula

TJ = TA + (PD × θJA)

ADP190/ADP191

Junction-to-ambient thermal resistance (θJA) of the package is

based on modeling and calculation using a 4-layer board. The

junction-to-ambient thermal resistance is highly dependent on

the application and board layout. In applications where high

maximum power dissipation exists, close attention to thermal

board design is required. The value of θJA may vary, depending on

PCB material, layout, and environmental conditions. The speci-

fied values of θJA are based on a 4-layer, 4 inch × 3 inch PCB.

See JESD51-7 and JESD51-9 for detailed information regarding

board construction. For additional information, see the AN-617

application note, MicroCSPTM Wafer Level Chip Scale Package.

ΨJB is the junction-to-board thermal characterization parameter

with units of °C/W. ΨJB of the package is based on modeling and

calculation using a 4-layer board. The JESD51-12 document,

Guidelines for Reporting and Using Electronic Package Thermal

Information, states that thermal characterization parameters are

not the same as thermal resistances. ΨJB measures the component

power flowing through multiple thermal paths rather than through

a single path, as in thermal resistance (θJB). Therefore, ΨJB thermal

paths include convection from the top of the package as well as

radiation from the package, factors that make ΨJB more useful

in real-world applications. Maximum junction temperature (TJ)

is calculated from the board temperature (TB) and the power

dissipation (PD) using the formula

TJ = TB + (PD × ΨJB)

See JESD51-8, JESD51-9, and JESD51-12 for more detailed

information about ΨJB.

THERMAL RESISTANCE

θJA and ΨJB are specified for the worst-case conditions, that is, a

device soldered in a circuit board for surface-mount packages.

Table 4. Thermal Resistance

Package Type

4-Ball, 0.4 mm Pitch WLCSP

θJA

ΨJB Unit

260 58.4 °C/W

ESD CAUTION

Rev. E | Page 5 of 16

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