ADS-951ME 查看數據表（PDF） - Murata Power Solutions

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ADS-951ME

18-Bit, 1MHz, Low-Power Sampling A/D Converters

Murata Power Solutions 

®

®

ADS-951

ANALOG OUTPUT

MIN.

+25°C

TYP.

MAX.

Internal Reference

Voltage

Drift

External Current

+4.95

+5.0

+5.05

—

±30

—

—

1

—

DIGITAL OUTPUTS

Logic Levels

Logic "1"

Logic "0"

Logic Loading "1"

Logic Loading "0"

Output Coding

POWER REQUIREMENTS

+2.4

—

—

—

—

+0.4

—

—

–4

—

—

+4

Power Supply Ranges

+15V Supply

–15V Supply

+5V Supply

–5V Supply

Power Supply Currents

+15V Supply

–15V Supply

+5V Supply

–5V Supply

Power Dissipation

Power Supply Rejection

+14.5

–14.5

+4.75

–4.75

—

—

—

—

—

—

+15.0

–15.0

+5.0

–5.0

+29

–15

+104

–54

1.45

—

+15.5

–15.5

+5.25

–5.25

—

—

—

—

1.65

±0.05

Footnotes:

➀ All power supplies must be on before applying a start convert pulse. All supplies

and the clock (START CONVERT) must be present during warmup periods. The

device must be continuously converting during this time.

➁ Contact DATEL for other input voltage ranges.

➂ A 1MHz clock with a 500nsec positive pulse width (50% duty cycle) is used for

all production testing. Any duty cycle may be used as long as a minimum

positive pulse width of 20nsec is maintained. For applications requiring lower

sampling rates, clock frequencies lower than 1MHz may be used.

0 to +70°C

MIN.

TYP. MAX.

–40 to +110°C

MIN. TYP.

MAX.

UNITS

+4.95

—

—

+5.0

+5.05

±30

—

1

—

+4.95

+5.0

—

±30

—

1

+5.05

—

—

Volts

ppm/°C

mA

+2.4

—

—

+2.4

—

—

—

+0.4

—

—

—

—

–4

—

—

—

—

+4

—

—

Complementary Offset Binary

—

Volts

+0.4

Volts

–4

mA

+4

mA

+14.5

–14.5

+4.75

–4.75

—

—

—

—

—

—

+15.0

–15.0

+5.0

–5.0

+29

–15

+104

–54

1.45

—

+15.5

–15.5

+5.25

–5.25

—

—

—

—

1.65

±0.05

+14.5

–14.5

+4.75

–4.75

—

—

—

—

—

—

+15.0

–15.0

+5.0

–5.0

+29

–15

+104

–54

1.45

—

+15.5

–15.5

+5.25

–5.25

—

—

—

—

1.65

±0.05

Volts

Volts

Volts

Volts

mA

mA

mA

mA

Watts

%FSR/%V

➃ Effective bits is equal to:

Full Scale Amplitude

(SNR + Distortion) – 1.76 + 20 log

Actual Input Amplitude

6.02

➄ This is the time required before the A/D output data is valid once the analog input

is back within the specified range.

TECHNICAL NOTES

1. Obtaining fully specified performance from the ADS-951

requires careful attention to pc-card layout and power

supply decoupling. The device's analog and digital ground

systems are not connected to each other internally. For

optimal performance, tie all ground pins (3, 12 and 13)

directly to a large analog ground plane beneath the

package.

Bypass all power supplies and the +5V REFERENCE

OUTPUT (pin 5) to ground with 10µF tantalum capacitors in

parallel with 0.1µF ceramic capacitors. Locate the bypass

capacitors as close to the unit as possible. Tie a 47µF

capacitor between COMPENSATION (pin 7) and ground.

2. The ADS-951 achieves its specified accuracies without the

need for external calibration. If required, the device's small

initial errors can be reduced to zero using the adjustment

circuitry shown in Figure 2. When using this circuitry, or any

similar offset and gain calibration hardware, make adjust-

ments following warmup. To avoid interaction, always adjust

offset before gain. Float pin 6 if not using gain adjust

circuits.

3. Applying a start convert pulse while a conversion is in

progress (EOC = logic "1") will initiate a new and probably

inaccurate conversion cycle. Data for the interrupted and

subsequent conversions will be invalid.

THERMAL REQUIREMENTS

All DATEL sampling A/D converters are fully characterized and

specified over operating temperature (case) ranges of 0 to

+70°C and –40 to +110°C. All room-temperature (TA = +25°C)

production testing is performed without the use of heat sinks or

forced-air cooling. Thermal impedance figures for each device

are listed in their respective specification tables.

These devices do not normally require heat sinks, however,

standard precautionary design and layout procedures should be

used to ensure devices do not overheat. The ground and power

planes beneath the package, as well as all pcb signal runs to

and from the device, should be as heavy as possible to help

conduct heat away from the package. Electrically-insulating,

thermally-conductive "pads" may be installed underneath the

package. Devices should be soldered to boards rather than

"socketed", and of course, minimal air flow over the surface can

greatly help reduce the package temperature.

3

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