ADT7475 查看數據表（PDF） - ON Semiconductor

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产品描述 (功能)

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ADT7475

dBCOOL® Remote Thermal Monitor and Fan Controller

ON Semiconductor 

ADT7475

SCL SDA SMBALERT

PWM1

PWM2

PWM3

TACH1

TACH2

TACH3

TACH4

THERM

VCC

D1+

D1–

D2+

D2–

VCCP

ADT7475

SERIAL BUS

INTERFACE

PWM

REGISTERS

AND

CONTROLLERS

(HF AND LF)

ACOUSTIC

ENHANCEMENT

CONTROL

AUTOMATIC

FAN SPEED

CONTROL

VCC TO ADT7475

FAN

SPEED

COUNTER

PERFORMANCE

MONITORING

THERMAL

PROTECTION

ADDRESS

POINTER

REGISTER

PWM

CONFIGURATION

REGISTERS

INTERRUPT

MASKING

INTERRUPT

STATUS

REGISTERS

BAND GAP

TEMPERATURE

SENSOR

INPUT

SIGNAL

CONDITIONING

AND

ANALOG

MULTIPLEXER

10−BIT

ADC

BAND GAP

REFERENCE

GND

LIMIT

COMPARATORS

VALUE AND

LIMIT

REGISTERS

Figure 1. Functional Block Diagram

ABSOLUTE MAXIMUM RATINGS

Parameter

Rating

Unit

Positive Supply Voltage (VCC)

Voltage on Any Input or Output Pin

3.6

V

−0.3 to +3.6

V

Input Current at Any Pin

±5

mA

Package Input Current

±20

mA

Maximum Junction Temperature (TJMAX)

150

°C

Storage Temperature Range

−65 to +150

°C

Lead Temperature, Soldering

°C

IR Reflow Peak Temperature

260

Lead Temperature (Soldering, 10 sec)

300

ESD Rating

1500

V

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.

THERMAL CHARACTERISTICS

Package Type

qJA

qJC

Unit

16−lead QSOP

150

39

°C/W

1. qJA is specified for the worst−case conditions, that is, a device soldered in a circuit board for surface−mount packages.

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