AFBR-5805ATZ 查看數據表（PDF） - Avago Technologies

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AFBR-5805ATZ

ATM Transceivers for SONET OC-3 / SDH STM-1 in Low Cost 1 x 9 Package Style

Avago Technologies 

Transmitter Sections

The transmitter section of the AFBR-5803Z and AFBR-

5805Z series utilize 1300 nm InGaAsP LEDs. These LEDs

are packaged in the optical subassembly portion of the

transmitter section. They are driven by a custom silicon IC

which converts differential PECL logic signals, ECL refer-

enced (shifted) to a +3.3 V or +5.0 V supply, into an analog

LED drive current.

Receiver Sections

The receiver section of the AFBR-5803Z and AFBR-

5805Z series utilize InGaAs PIN photodiodes coupled to

a custom silicon transimpedance preamplifier IC. These

are packaged in the optical subassembly portion of the

receiver.

These PIN/preamplifier combinations are coupled to

a custom quantizer IC which provides the final pulse

shaping for the logic output and the Signal Detect func-

tion. The data output is dif-ferential. The signal detect

output is single-ended. Both data and signal detect

outputs are PECL compatible, ECL referenced (shifted) to

a 3.3 V or +5.0 V power supply.

Package

The overall package concept for the Avago Technologies

transceivers consists of three basic elements; the two

optical subassemblies, an electrical subassembly and the

housing as illustrated in Figure 1a and Figure 1b.

The package outline drawing and pin out are shown in

Figures 2a, 2b and 3. The details of this package outline

and pin out are compliant with the multisource definition

of the 1 x 9 SIP. The low profile of the Avago Technologies

transceiver design complies with the maximum height

allowed for the duplex SC connector over the entire

length of the package.

The optical subassemblies utilize a high volume assem-

bly process together with low cost lens elements which

result in a cost effective building block.

The electrical subassembly consists of a high volume

multilayer printed circuit board on which the IC chips and

various surface-mounted passive circuit elements are at-

tached.

The package includes internal shields for the electrical

and optical subassemblies to ensure low EMI emissions

and high immunity to external EMI fields.

The outer housing including the duplex SC connector or

the duplex ST ports is molded of filled nonconductive

plastic to provide mechanical strength and electrical iso-

lation. The solder posts of the Avago Technologies design

are isolated from the circuit design of the transceiver

and do not require connection to a ground plane on the

circuit board.

The transceiver is attached to a printed circuit board with

the nine signal pins and the two solder posts which exit

the bottom of the housing. The two solder posts provide

the primary mechanical strength to withstand the loads

imposed on the transceiver by mating with duplex or

simplex SC or ST connectored fiber cables.

DIFFERENTIAL

DATA OUT

SINGLE-ENDED

SIGNAL

DETECT OUT

ELECTRICAL SUBASSEMBLY

DUPLEX SC

RECEPTACLE

PIN PHOTODIODE

QUANTIZER IC

PREAMP IC

OPTICAL

SUBASSEMBLIES

DIFFERENTIAL

LED

DATA IN

DRIVER IC

Figure 1a. SC Connector Block Diagram

TOP VIEW

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