AIC1526 查看數據表（PDF） - Analog Intergrations
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AIC1526 Datasheet PDF : 8 Pages
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AIC1526
APPLICATION INFORMATION
Error Flag
An open-drained output of an N-channel
MOSFET, the FLG output is pulled low to signal
the following fault conditions: input undervoltage,
output current limit, and thermal shutdown.
Current Limit
The current limit threshold is preset internally. It
protects the output MOSFET switches from
damage due to undesirable short circuit
conditions or excess inrush current often
encountered during hot plug-in. The low limit of
the current limit threshold of the AIC1526 allows
a minimum current of 0.5A through the MOSFET
switches. A current limit condition will signal the
error flag.
Thermal Shutdown
When the chip temperature exceeds 135°C for
any reason other than overcurrent fault of either
one of the two MOSFET switches, the thermal
shutdown function turns off both MOSFET
switches and signal the error flag. A hysteresis of
10°C prevents the MOSFETs from turning back
on until the chip temperature drops to below
125°C. However, if thermal shutdown is triggered
by chip temperature rise due to overcurrent fault
condition of either one of the MOSFET switches,
the thermal shutdown function will only turn off
the switch that is in overcurrent condition and the
other switch can still remain its normal operation.
In other words, the thermal shutdown function of
the two switches is independent of each other in
the case of overcurrent fault.
Supply Filtering
A 0.1µF to 1µF bypass capacitor from IN to GND,
located near the device, is strongly
recommended to control supply transients.
Without a bypass capacitor, an output short may
cause sufficient ringing on the input (from supply
lead inductance) to damage internal control
circuitry.
Transient Droop Requirements
USB support dynamic attachment (hot plug-in) of
peripherals. A current surge is caused by the
input capacitance of downstream device. Ferrite
beads are recommended in series with all power
and ground connector pins. Ferrite beads reduce
EMI and limit the inrush current during hot-
attachment by filtering high-frequency signals.
Short Circuit Transient
Bulk capacitance provides the short-term
transient current needed during a hot-attachment
event. With a 33µF, 16V tantalum or 100µF, 10V
electrolytic capacitor mounted close to
downstream connector per port should provide
transient drop protection.
Printed Circuit Layout
The power circuitry of USB printed circuit boards
requires a customized layout to maximize
thermal dissipation and to minimize voltage drop
and EMI.
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