SUPPLEMENT
PRODUCT TEST FLOW
Figure 1 provides an overview of AMD’s Known Good
Die test flow. For more detailed information, refer to the
Am29F010 product qualification database supplement
for KGD. AMD implements quality assurance proce-
dures throughout the product test flow. In addition, an
off-line quality monitoring program (QMP) further guar-
antees AMD quality standards are met on Known Good
Die products. These QA procedures also allow AMD to
produce KGD products without requiring or imple-
menting burn-in.
Wafer Sort 1
Bake
24 hours at 250°C
DC Parameters
Functionality
Programmability
Erasability
Data Retention
Wafer Sort 2
DC Parameters
Functionality
Programmability
Erasability
Wafer Sort 3
High Temperature
DC Parameters
Functionality
Programmability
Erasability
Speed
Packaging for Shipment
Incoming Inspection
Wafer Saw
Die Separation
100% Visual Inspection
Die Pack
Shipment
Figure 1. AMD KGD Product Test Flow
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