AM70PDL127CDH 查看數據表（PDF） - Spansion Inc.

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AM70PDL127CDH

Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP)

Spansion Inc. 

ADVANCE INFORMATION

Figure 24. Sector Group Protect and Unprotect Timing Diagram . 119

Alternate CE# Controlled Erase and Program Operations ... 120

Figure 25. Alternate CE# Controlled Write (Erase/Program)

Operation Timings......................................................................... 121

Erase And Programming Performance . . . . . . . 122

Latchup Characteristics . . . . . . . . . . . . . . . . . . 122

Package Pin Capacitance. . . . . . . . . . . . . . . . . . 123

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . 124

FUA093—93-Ball Fine-Pitch Grid Array 13 x 9 mm package 124

Revision Summary . . . . . . . . . . . . . . . . . . . . . . . 125

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Am70PDL127CDH/Am70PDL129CDH

November 24, 2003

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