AME385AEHSZ 查看數據表（PDF） - AME, Inc

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AME385AEHSZ

Shunt Bandgap Voltage Reference

AME, Inc 

AME

AME385-1.2

Shunt Bandgap Voltage Reference

n Thermal Information

Parameter

Package Die Attach Symbol Maximum Unit

Thermal Resistance*

(Junction to Case)

SOT-23

Non-Conductive

TO-92-2

TO-92-3

Epoxy

θJC

SOP-8

Conductive

Epoxy

Thermal Resistance

(Junction to Ambient)

SOT-23

Non-Conductive

TO-92-2

TO-92-3

Epoxy

θJA

SOP-8

Conductive

Epoxy

Internal Power Dissipation

SOT-23

Non-Conductive

TO-92-2

TO-92-3

Epoxy

PD

SOP-8

Conductive

Epoxy

Maximum Junction Temperature

Solder Iron (10 Sec)**

140

80

oC / W

60

280

150

oC / W

150

400

625

mW

810

150

oC

350

oC

* Measure θJC on center of molding compound if IC has no tab.

** MIL-STD-202G 210F

6

Rev.G.03

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