AMMC-6232-W50(2006) 查看數據表（PDF） - Avago Technologies
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AMMC-6232-W50 Datasheet PDF : 8 Pages
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Assembly Techniques
The backside of the MMIC chip is RF ground. For microstrip
applications the chip should be attached directly to
the ground plane (e.g. circuit carrier or heatsink) using
electrically conductive epoxy [1]
For best performance, the topside of the MMIC should be
brought up to the same height as the circuit surrounding
it. This can be accomplished by mounting a gold plated
metal shim (same length as the MMIC) under the chip
which is of correct thickness to make the chip and adjacent
circuit the same height. The amount of epoxy used for
the chip or shim attachment should be just enough to
provide a thin fillet around the bottom perimeter of the
chip. The ground plane should be free of any residue that
may jeopardize electrical or mechanical attachment.
RF connections should be kept as short as reasonable to
minimize performance degradation due to undesirable
series inductance. A single bond wire is normally sufficient
for signal connections, however double bonding with
0.7mil gold wire will reduce series inductance. Gold
thermo-sonic wedge bonding is the preferred method
for wire attachment to the bond pads. The recommended
wire bond stage temperature is 150°c ± 2°c.
VD1
0
800
725
875
Caution should be taken to not exceed the Absolute
Maximum Rating for assembly temperature and time.
The chip is 100um thick and should be handled with care.
This MMIC has exposed air bridges on the top surface and
should be handled by the edges or with a custom collet
(do not pick up the die with a vacuum on die center).
Bonding pads and chip backside metallization are gold.
This MMIC is also static sensitive and ESD precautions
should be taken
For more detailed information see Avago Technolgies’
application note #54 “GaAs MMIC assembly and handling
guidelines”
Notes:
[1] Ablebond 84-1 LMI silver epoxy is recommended
Ordering Information:
AMMC-6232-W10 = 10 devices per tray
AMMC-6232-W50 = 50 devices per tray
VD2
1370
1510
2000
800
650
410
425
RFin
RFout
275
290
0
540
0 130
Figure 22. Bond Pad Locations
660
VG1
0
1470
1600
VG2
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved.
AV01-0440EN - November 29, 2006
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