AMMC-6241(2006) 查看數據表（PDF） - Avago Technologies
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AMMC-6241 Datasheet PDF : 8 Pages
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Biasing and Operation
The AMMC-6241 is normally biased with a positive
supply connected to both VD1 and VD2 bond pads
through the 100pF bypass capacitor as shown in Figure
21. The recommended supply voltage is 3 V. It is
important to place the bypass capacitor as close to
the die as possible. No negative gate bias voltage is
needed for the AMMC-6241. Input and output
matching are achieved on-die, therefore no other
external component is required besides one 100pF
bypass capacitor for the main supply. The input and
output are DC-blocked with internal coupling
capacitors.
No ground wires are needed because all ground
connections are made with plated through-holes to
the backside of the device.
Refer the Absolute Maximum Ratings table for allowed
DC and thermal conditions.
Assembly Techniques
The backside of the MMIC chip is RF ground. For
microstrip applications the chip should be attached
directly to the ground plane (e.g. circuit carrier or
heatsink) using electrically conductive epoxy [1]
For best performance, the topside of the MMIC should
be brought up to the same height as the circuit
surrounding it. This can be accomplished by mounting
a gold plate metal shim (same length and width as the
MMIC) under the chip which is of correct thickness to
make the chip and adjacent circuit the same height.
The amount of epoxy used for the chip and/or shim
attachment should be just enough to provide a thin
fillet around the bottom perimeter of the chip or shim.
The ground plan should be free of any residue that
may jeopardize electrical or mechanical attachment.
The location of the RF bond pads is shown in Figure
12. Note that all the RF input and output ports are in a
Ground-Signal-Ground configuration.
RF connections should be kept as short as reasonable
to minimize performance degradation due to
undesirable series inductance. A single bond wire is
normally sufficient for signal connections, however
double bonding with 0.7 mil gold wire or use of gold
mesh [2] is recommended for best performance,
especially near the high end of the frequency band.
Thermosonic wedge bonding is preferred method for
wire attachment to the bond pads. Gold mesh can be
attached using a 2 mil round tracking tool and a tool
force of approximately 22 grams and a ultrasonic power
of roughly 55 dB for a duration of 76 +/- 8 mS. The
guided wedge at an untrasonic power level of 64 dB
can be used for 0.7 mil wire. The recommended wire
bond stage temperature is 150 +/- 2C.
Caution should be taken to not exceed the Absolute
Maximum
Notes:
[1] Ablebond 84-1 LM1 silver epoxy is recommended.
[2] Buckbee-Mears Corporation, St. Paul, MN, 800-262-3824
VD1
VD2
RFin
RFou
Figure 18. AMMC-6241 Simplified Schematic
7
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