AMMC-5026-W50(2006) 查看數據表（PDF） - Avago Technologies
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AMMC-5026-W50 Datasheet PDF : 8 Pages
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89
750
(Vd)
(Aux Vd)
840 505
(±10 µm)
252
2964
(RF Output Pad)
587
318
(Aux Vg2)
89 (RF Input Pad)
3050 (± 10 µm)
Figure 16. AMMC-5026 Bonding Pad Locations. (dimensions in micrometers)
2323 2563
2951
(Vg1) (Aux Vg1)
Notes:
All dimensions in microns.
Rectangular Pad Dim: 75 x 75 µm
1.5 mil dia.Gold Wire Bond
to ≥15 nF DC Feedthru
4 nH Inductor
(1.0 mil Gold Wire Bond
with length of 200 mils)
≥68 pF Capacitor
Gold Plated Shim
2.0 mil
nom. gap
Input and Output Thin Film
Circuit with ≥8 pF
DC Blocking Capacitor
Vd
HMMC-5026 OUT
IN
Vg
2.0 mil
nom. gap
0.7 mil dia. Gold Bond Wire
(Length Not important)
Figure 17. AMMC-5026 Assembly Diagram.
Bonding Island
1.5 mil dia.Gold Wire Bond
to ≥15 nF DC Feedthru
Ordering Information
AMMC-5026-W10 = 10 devices per tray
AMMC-5026-W50 = 50 devices per tray
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited
in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies, Limited. All rights reserved.
Obsoletes 5989-3212EN
5989-3929EN September 8, 2006
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