CHA5296-99F/00 查看數據表（PDF） - United Monolithic Semiconductors
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CHA5296-99F/00 Datasheet PDF : 6 Pages
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27-30GHz High Power Amplifier
Chip Assembly and Mechanical Data
CHA5296
Note : Supply feed should be capacitively bypassed. 25µm diameter gold wire is to be prefered.
Bonding pad positions.
( Chip thickness : 50µm. All dimensions are in micrometers )
Ref. : DSCHA52962147 - 27-May-02
5/6
Specifications subject to change without notice
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Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
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