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AOD424 查看數據表(PDF) - Unspecified

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AOD424
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AOD424 Datasheet PDF : 6 Pages
1 2 3 4 5 6
AOD424
20V N-Channel MOSFET
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
Conditions
Min Typ Max Units
STATIC PARAMETERS
BVDSS Drain-Source Breakdown Voltage
ID=250µA, VGS=0V
20
V
IDSS
Zero Gate Voltage Drain Current
VDS=20V, VGS=0V
TJ=55°C
1
µA
5
IGSS
Gate-Body leakage current
VDS=0V, VGS= ±12V
100 nA
VGS(th) Gate Threshold Voltage
VDS=VGS ID=250µA
0.5
1
1.6
V
ID(ON)
On state drain current
VGS=10V, VDS=5V
160
A
RDS(ON) Static Drain-Source On-Resistance
VGS=4.5V, ID=20A
TJ=125°C
3.6 4.4
m
5.1 6.2
VGS=2.5V, ID=20A
4.5 5.7 m
gFS
Forward Transconductance
VDS=5V, ID=20A
105
S
VSD
Diode Forward Voltage
IS=1A,VGS=0V
IS
Maximum Body-Diode Continuous CurrentG
0.7
1
V
45
A
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
VGS=0V, VDS=10V, f=1MHz
VGS=0V, VDS=0V, f=1MHz
3080 3860 4630 pF
520 740 960 pF
350 580 810 pF
0.6 1.4 2.1
SWITCHING PARAMETERS
Qg(4.5V) Total Gate Charge
28
36
43
nC
Qgs
Gate Source Charge
VGS=10V, VDS=10V, ID=20A
9
nC
Qgd
Gate Drain Charge
12
nC
tD(on)
Turn-On DelayTime
7
ns
tr
Turn-On Rise Time
VGS=10V, VDS=10V, RL=0.5,
8
ns
tD(off)
Turn-Off DelayTime
RGEN=3
70
ns
tf
Turn-Off Fall Time
18
ns
trr
Body Diode Reverse Recovery Time IF=20A, dI/dt=500A/µs
13
17
20
ns
Qrr
Body Diode Reverse Recovery Charge IF=20A, dI/dt=500A/µs
29
36
43
nC
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The
Power dissipation PDSM is based on R θJA and the maximum allowed junction temperature of 150°C. The value in any given application depends
on the user's specific board design, and the maximum temperature of 175°C may be used if the PCB allows it.
B. The power dissipation PD is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper
dissipation limit for cases where additional heatsinking is used.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=175°C. Ratings are based on low frequency and duty cycles to keep
initial TJ =25°C.
D. The RθJA is the sum of the thermal impedence from junction to case RθJC and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming
a maximum junction temperature of TJ(MAX)=175°C. The SOA curve provides a single pulse rating.
G. The maximum current rating is package limited.
H. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C.
2/6
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