APW7322 查看數據表（PDF） - Anpec Electronics
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APW7322 Datasheet PDF : 22 Pages
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APW7322/A
Ordering and Marking Information
APW7322
APW7322A
Assembly Material
Handling Code
Temperature Range
Package Code
Package Code
K : SOP-8
QB : TDFN3x3-10
Operating Ambient Temperature Range
I : -40 to 85 oC
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
APW7322 K:
APW7322
XXXXX
XXXXX - Date Code
APW7322A K:
APW7322A
XXXXX
XXXXX - Date Code
APW7322 QB:
APW
7322
XXXXX
XXXXX - Date Code
APW7322A QB:
APW
7322A
XXXXX
XXXXX - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Absolute Maximum Ratings (Note 1)
Symbol
Parameter
Rating
Unit
VIN, VCC
VLX
VIN and VCC Input Voltage
LX to GND Voltage
FB, EN, POK to GND Voltage
>20ns
<20ns
-0.3 ~ 7
V
-1 ~VIN+0.3
V
VPGND -5V ~9V
-0.3 ~ 6.5
V
PD
Power Dissipation
Internally Limited
W
TJ
Junction Temperature
150
oC
TSTG
Storage Temperature
-65 ~ 150
oC
TSDR
Maximum Lead Soldering Temperature(10 Seconds)
260
oC
Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-
mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability
Thermal Characteristics
Symbol
Parameter
Typical Value
Unit
Junction-to-Ambient Resistance in Free Air (Note 2)
θJA
SOP-8
150
oC/W
TDFN3x3-10
50
Junction-to-Case Resistance in Free Air (Note 3)
θJC
SOP-8
20
oC/W
TDFN3x3-10
6
Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. The exposed pad
of SOP-8 and TDFN3x3-10 is soldered directly on the PCB.
Note 3: The case temperature is measured at the center of the exposed pad on the underside of the SOP-8 package.
Copyright © ANPEC Electronics Corp.
2
Rev. A.6 - Aug., 2013
www.anpec.com.tw
Free Datasheet http://www.datasheetlist.com/
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