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AS1310-BTDT-XX2 查看數據表(PDF) - austriamicrosystems AG

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AS1310-BTDT-XX2 Datasheet PDF : 20 Pages
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AS1310
Datasheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 4 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Electrical Parameters
lid VIN, VOUT, EN, LBI, LBO to GND
LX, REF to GND
Input Current (latch-up immunity)
a Electrostatic Discharge
Electrostatic Discharge HBM
v Temperature Ranges and Storage Conditions
ill Thermal Resistance θJA
Junction Temperature
t Storage Temperature Range
G s Package Body Temperature
s A nt Humidity non-condensing
Technicaaml conte MoistureSensitiveLevel
Min
Max
Units
Comments
-0.3
+5
V
-0.3 VOUT + 0.3 V
-100
100
mA
Norm: JEDEC 78
±2
kV
Norm: MIL 883 E method 3015
58
+125
-55
+125
+260
5
85
1
ºC/W
ºC
ºC
The reflow peak soldering temperature (body
temperature) specified is in accordance with IPC/
JEDEC J-STD-020“Moisture/Reflow Sensitivity
ºC Classification for Non-Hermetic Solid State Surface
Mount Devices”.
The lead finish for Pb-free leaded packages is matte
tin (100% Sn).
%
Represents a maximum floor life time of unlimited
www.austriamicrosystems.com/DC-DC_Step-Up/AS1310
Revision 1.8
3 - 19

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