AS1334-BTDT-12(2009) 查看數據表（PDF） - austriamicrosystems AG

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AS1334-BTDT-12
(Rev.:2009)

650mA, Ultra low Ripple Step Down DC/DC Converter

austriamicrosystems AG 

AS1334

Datasheet - Absolute Maximum Ratings

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in Electrical

Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may

affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Notes

VDD, PVIN to SGND

-0.3

+7.0

V

PGND to SGND

-0.3

+0.3

V

POK, EN, FB

SW

SGND - 0.3 VDD + 0.3

V

PGND - 0.3 PVIN + 0.3 V

7.0V max

PVIN to VDD

-0.3

+0.3

V

Operating Temperature Range

Junction Temperature (TJ-MAX)

Storage Temperature Range

Maximum Lead Temperature

(Soldering, 10 sec)

ESD Rating

-40

+85

°C

+150

ºC

-65

+150

ºC

+260

ºC

Human Body Model

Operating Ratings

2

kV

HBM MIL-Std. 883E 3015.7 methods

Input Voltage Range

2.7

5.5

V

Recommended Load Current

650

mA

Junction Temperature (TJ) Range

-40

+125

ºC

In applications where high power

dissipation and/or poor package thermal

resistance is present, the maximum

ambient temperature may have to be

derated.

Maximum ambient temperature (TA-MAX)

is dependent on the maximum operating

Ambient Temperature (TA) Range

-40

+85

ºC

junction temperature (TJ-MAX-OP =

125ºC), the maximum power dissipation

of the device in the application (PD-MAX),

and the junction-to ambient thermal

resistance of the part/package in the

application (θJA), as given by the

following

equation: TA-MAX = TJ-MAX-OP – (θJA ×

PD-MAX).

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