AS1160 查看數據表（PDF） - austriamicrosystems AG
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AS1160
austriamicrosystems AG
AS1160 Datasheet PDF : 29 Pages
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AS1160/AS1161
Datasheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Electrical Character-
istics on page 6 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Table 3. Absolute Maximum Ratings
Parameter
Min Max Units
Comments
AVDD, DVDD
-0.3 +4
V
LVCMOS/LVTTL Input
-0.3
VDD +
0.3
V
LVCMOS/LVTTL Output
-0.3
VDD +
0.3
V
Bus LVDS Receiver Input/Output
-0.3 +3.9 V
Bus LVDS Output Short-Circuit Duration
10 ms
Power Dissipation
θJA
ESD
Operating Temperature
Storage Temperature
Junction Temperature
Package Body Temperature
1.47
85
2
-40 +85
-65 +150
+150
+260
W
Derate at 11.8mW/ºC above 25ºC
ºC/W
kV
HBM MIL-Std. 883E 3015.7 methods;
ºC
ºC
ºC
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020D “Moisture/Reflow
ºC Sensitivity Classification for Non-Hermetic
Solid State Surface Mount Devices”.
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
www.austriamicrosystems.com/Interfaces-LVDS/AS1160_61
Revision 1.01
5 - 29
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