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AS1748 查看數據表(PDF) - austriamicrosystems AG

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AS1748 Datasheet PDF : 17 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
AS1747, AS1748, AS1749, AS1750
Datasheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Electrical Character-
istics on page 5 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Table 3. Absolute Maximum Ratings
Parameter
VCC, IN_, CMP-
lid COM_, NO_, NC_
Min
-0.3
VCC - 6
CMPO
0.3
a Closed-Switch Continuous Current COM_,
v NO_, NC_
Open-Switch Continuous Current NO_, NC_
ill (AS1749/AS1750)
Peak Current COM_, NO_, NC_
(pulsed at 1ms, 10% duty cycle)
t Continuous Power Dissipation (TA = +70ºC)
G s 10-pin TDFN 3x3
(derate 24.4mW/ºC above +70ºC)
A t 12-Bump WL-CSP (AS1747/AS1749)
(derate 5.6mW/ºC above +70ºC)
s n 12-Bump WL-CSP (AS1748/AS1750)
(derate 6.5mW/ºC above +70ºC)
e 16-pin TQFN 3x3
m t (derate 16.9mW/ºC above +70ºC)
ESD
a n Latchup Immunity
o Operating Temperature Range
Junction Temperature
c Storage Temperature Range
-200
-40
-65
Max
+6.0
VCC +
0.3
VCC +
0.3
±150
±30
±400
1951
449
519
1349
2
+200
+85
+150
+150
Technical Package Body Temperature
+260
Units
V
V
V
mA
mA
mA
Comments
mW
mW
mW
mW
kV HBM MIL-Std. 883E 3015.7 methods
mA
@25°C, JEDEC 78
ºC
ºC
ºC
The reflow peak soldering temperature
(body temperature) specified is in
accordance with IPC/JEDEC J-STD-
ºC
020D “Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid
State Surface Mount Devices”.
The lead finish for Pb-free leaded
packages is matte tin (100% Sn).
www.austriamicrosystems.com/Analog-Switches/AS1747-50 Revision 1.02
4 - 16

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