DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

ASM0406C 查看數據表(PDF) - APLUS INTEGRATED CIRCUITS

零件编号
产品描述 (功能)
生产厂家
ASM0406C Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
1.4 Bonding Diagram
ASM0406C
16K x 10 bit ROM
Y= 1360+80(um)
1
2
ASM0406C
11
CHIP SIZE: X= 1550+80(um) , Y= 1360+80(um)
10
3
4
5
6
7
8
9
X= 1550+80(um)
Substrate must be connected to GND.
ASM0406C Pad Location
PAD # PAD Name
1 RA3
2 RA2
3 RA1
4 RA0
5 OSC
6 GND
X
-664.92
-664.92
-662.64
-468.24
-281.04
-111.72
Chip Size: X= 1550 + 80 (um), Y=1360 + 80 (um)
Y PAD # PAD Name
X
Y
-275.52 7 TEST
105.44 -600.2
-403.64 8 COUT
303.96 -600.2
-600.2 9 VDD
683.04 -600.2
-600.2 10 RB0
664.92 -399.2
-600.2 11 RB1
664.92 -280.8
-600.2
5

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]