ASM17012CB 查看數據表（PDF） - APLUS INTEGRATED CIRCUITS

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ASM17012CB

VERY LOW-COST VOICE SYNTHESIZER WITH 4-BIT MICROPROCESSOR

APLUS INTEGRATED CIRCUITS 

1.4 Bonding Diagram

ASM17012CB

Y= 3140 + 80 (um)

(256K x 10 bit) x 2-Block ROM

ASM17012CB

CHIP SIZE: X= 3090 + 100 (um), Y= 3140 + 80 (um)

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21

X= 3090 + 100 (um)

Substrate must be connected to GND.

ASM17012CB Pad Location

PAD # PAD Name

X

1 VDD3

-1445.96

2 PRC1

-1325.24

3 PRC0

-1202.92

4 PRA3

-1080.6

5 PRA2

-958.28

6 PRA1

-835.96

7 PRA0/RESET

-713.64

8 OSC

-591.32

9 VDD1

-414.36

10 COUT

-162.24

11 GND1

38.72

Chip Size: X= 3090 + 100 (um) , Y= 3140 + 80 (um)

Y

PAD # PAD Name

X

Y

-1456.08 12 GND2

118.72 -1450.56

-1456.08 13 TEST

319.68 -1456.08

-1456.08 14 VDD2

575.32 -1456.08

-1456.08 15 PRB0

714.48 -1456.08

-1456.08 16 PRB1

836.8 -1456.08

-1456.08 17 PRB2

959.12 -1456.08

-1456.08 18 PRB3

1081.44 -1456.08

-1456.08 19 PRC2

1203.76 -1456.08

-1456.08 20 PRC3

1326.08 -1456.08

-1456.08 21 GND3

1449.36 -1456.08

-1450.56

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