NDM3000 查看數據表（PDF） - Fairchild Semiconductor
零件编号
产品描述 (功能)
生产厂家
NDM3000 Datasheet PDF : 12 Pages
| |||
Electrical Characteristics (TA = 25°C unless otherwise noted)
Symbol Parameter
Conditions
Type
Min Typ Max Units
SWITCHING CHARACTERISTICS (Note 3)
tD(on)
Turn - On Delay Time
tr
Turn - On Rise Time
tD(off)
Turn - Off Delay Time
tf
Turn - Off Fall Time
Q1, Q3, Q5
VDD = -15 V, ID = -1 A,
VGEN = -10 V, RGEN = 6 Ω
Q2, Q4, Q6
VDD = 15 V, ID = 1 A,
VGEN = 10 V, RGEN = 6 Ω
Q1, Q3, Q5
Q2, Q4, Q6
Q1, Q3, Q5
Q2, Q4, Q6
Q1, Q3, Q5
Q2, Q4, Q6
Q1, Q3, Q5
Q2, Q4, Q6
10 40 ns
9
40
13 40 ns
21 40
21 90 ns
21 90
5
50 ns
8
50
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
Q1, Q3, Q5
VDS = -10 V,
ID = -3.0 A, VGS = -10 V
Q2, Q4, Q6
VDS = 10 V,
ID = 3.0 A, VGS = 10 V
Q1, Q3, Q5
Q2, Q4, Q6
Q1, Q3, Q5
Q2, Q4, Q6
Q1, Q3, Q5
Q2, Q4, Q6
10 25 nC
9.5 25
1.6
nC
1.5
3
nC
2.5
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS
IS
Maximum Continuous Drain-Source Diode Forward Current
Q1, Q3, Q5
Q2, Q4, Q6
-1.2 A
1.2
VSD
Drain-Source Diode Forward
VGS = 0 V, IS = -3.0 A (Note 3)
Voltage
VGS = 0 V, IS = 3.0 A (Note 3)
Q1, Q3, Q5
Q2, Q4, Q6
-0.8 -1.3 V
0.8 1.3
trr
Reverse Recovery Time
VGS = 0 V, I F = ±3.0 A,
dI F /dt = 100 A/µs
All
100 ns
Notes:
1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by
design while RθCA is determined by the user's board design.
( ) = = = ( ) × PD t
TJ−TA
RθJ A(t)
TJ−TA
RθJ C+RθCA(t)
I
2
D
t
RDS(ON ) TJ
Typical RθJA using the board layouts shown below on 4.5"x5" FR-4 PCB in a still air environment:
a. 50oC/W when mounted on a 1 in2 pad of 2oz cpper.
b. 80oC/W when mounted on a 0.027 in2 pad of 2oz cpper.
c. 90oC/W when mounted on a 0.0028 in2 pad of 2oz cpper.
1a
1b
1c
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%.
NDM3000 Rev. E
Share Link: 