LM7818CK 查看數據表（PDF） - International Cmos Technology

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LM7818CK

3-Terminal Positive Regulators

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LM340/LM7800C Electrical Characteristics (Note 4) (Continued)

0˚C ≤ TJ ≤ +125˚C unless otherwise specified

Output Voltage

5V

12V

15V

Symbol

Input Voltage (unless otherwise noted)

10V

19V

23V

Units

Parameter

Conditions

Min Typ Max Min Typ Max Min Typ Max

IO ≤ 500 mA, 0˚C ≤ TJ ≤ +125˚C

VMIN ≤ VIN ≤ VMAX

1.0

(7 ≤ VIN ≤ 25)

1.0

1.0 mA

(14.5 ≤ VIN ≤ (17.5 ≤ VIN ≤ 30) V

30)

VN

Output Noise

TA = 25˚C, 10 Hz ≤ f ≤ 100 kHz

40

75

90

µV

Voltage

Ripple Rejection

IO ≤ 1A, TJ =

62 80

55 72

54 70

dB

25˚C

f = 120 Hz

or IO ≤ 500 mA, 62

55

54

dB

0˚C ≤ TJ ≤ +125˚C

VMIN ≤ VIN ≤ VMAX

(8 ≤ VIN ≤ 18) (15 ≤ VIN ≤ 25) (18.5 ≤ VIN ≤

V

28.5)

RO

Dropout Voltage

TJ = 25˚C, IO = 1A

Output Resistance f = 1 kHz

2.0

2.0

2.0

V

8

18

19

mΩ

Short-Circuit Current TJ = 25˚C

Peak Output

TJ = 25˚C

Current

2.1

1.5

1.2

A

2.4

2.4

2.4

A

Average TC of VOUT 0˚C ≤ TJ ≤ +125˚C, IO = 5 mA

−0.6

−1.5

−1.8

mV/˚C

VIN

Input Voltage

TJ = 25˚C, IO ≤ 1A

Required to

7.5

14.6

17.7

V

Maintain

Line Regulation

Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions

but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics.

Note 2: The maximum allowable power dissipation at any ambient temperature is a function of the maximum junction temperature for operation (TJMAX = 125˚C

or 150˚C), the junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA). PDMAX = (TJMAX − TA)/θJA. If this dissipation is exceeded, the die

temperature will rise above TJMAX and the electrical specifications do not apply. If the die temperature rises above 150˚C, the device will go into thermal shutdown.

For the TO-3 package (K, KC), the junction-to-ambient thermal resistance (θJA) is 39˚C/W. When using a heatsink, θJA is the sum of the 4˚C/W junction-to-case

thermal resistance (θJC) of the TO-3 package and the case-to-ambient thermal resistance of the heatsink. For the TO-220 package (T), θJA is 54˚C/W and θJC is

4˚C/W. If SOT-223 is used, the junction-to-ambient thermal resistance is 174˚C/W and can be reduced by a heatsink (see Applications Hints on heatsinking).

If the TO-263 package is used, the thermal resistance can be reduced by increasing the PC board copper area thermally connected to the package: Using 0.5 square

inches of copper area, θJA is 50˚C/W; with 1 square inch of copper area, θJAis 37˚C/W; and with 1.6 or more inches of copper area, θJA is 32˚C/W.

Note 3: ESD rating is based on the human body model, 100 pF discharged through 1.5 kΩ.

Note 4: All characteristics are measured with a 0.22 µF capacitor from input to ground and a 0.1 µF capacitor from output to ground. All characteristics except noise

voltage and ripple rejection ratio are measured using pulse techniques (tw ≤ 10 ms, duty cycle ≤ 5%). Output voltage changes due to changes in internal temperature

must be taken into account separately.

Note 5: A military RETS specification is available on request. At the time of printing, the military RETS specifications for the LM140AK-5.0/883, LM140AK-12/883,

and LM140AK-15/883 complied with the min and max limits for the respective versions of the LM140A. At the time of printing, the military RETS specifications for

the LM140K-5.0/883, LM140K-12/883, and LM140K-15/883 complied with the min and max limits for the respective versions of the LM140. The LM140H/883,

LM140K/883, and LM140AK/883 may also be procured as a Standard Military Drawing.

5

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