BAT41KFILM 查看數據表（PDF） - STMicroelectronics
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BAT41KFILM Datasheet PDF : 12 Pages
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Characteristics
BAT41 Series
Figure 7. Forward voltage drop versus
forward current (typical values)
IFM(A)
1.E+00
1.E-01
1.E-02
Tj=125°C
Tj=100°C
Tj=25°C
1.E-03
1.E-04
VFM(V)
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2
Figure 8.
Variation of thermal impedance
junction to ambient versus pulse
duration (printed circuit board,
epoxy FR4, eCU=35 µm, SOT323-6L)
Zth(j-a)(°C/W)
1000
SOT323-6L
100
Single pulse
10
1.E-02
1.E-01
tp(s)
1.E+00
1.E+01
1.E+02
Figure 9.
Relative variation of thermal
impedance junction to ambient
versus pulse duration (alumine
substrate, SOT-23) (printed circuit
board, epoxy FR4, eCU=35 µm,
SOD-323)
Zth(j-a)/Rth(j-a)
1.00
Figure 10.
Relative variation of thermal
impedance junction to ambient
versus pulse duration (printed
circuit board, epoxy FR4, eCU=35
µm, SOT-666 and SOD-523)
Zth(j-a)/Rth(j-a)
1.00
SOT-23
Alumine substrate
10 x 8 x 0.5 mm
Single pulse
0.10
SOD-323
Epoxy FR4
SCU = 2.25 mm2
eCU = 35 µm
SOD-523
Epoxy FR4
eCU = 35 µm
Single pulse
0.10
SOT-666
Epoxy FR4
eCU = 35 µm
0.01
1.E-02
1.E-01
tp(s)
1.E+00
1.E+01
1.E+02
Figure 11.
Thermal resistance junction to
ambient versus copper surface
under each lead (printed circuit
board, epoxy FR4, eCU=35 µm,
SOD-323)
Rth(j-a)(°C/W)
600
550
500
450
400
350
300
0
SCU(mm²)
5
10
15
20
25
30
35
40
45
50
0.01
1.E-03
1.E-02
tp(s)
1.E-01
1.E+00
1.E+01
4/12
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